The Class 100 Clean Room is used for Photolithography, Flip Chip Bonding and chemical etching. The lighting has 0% transmittance below 540 nanometers for light-sensitive materials.

The ultra-clean environment enables the fabrication of advanced microsystems and MEMS (micro-electrical-mechanical systems) devices down to the 1-micron size range.

The Class 1000 space offers a range of inspection, patterning and integration tools including non-contact profilometry, flip-chip integration, thin-film deposition, and laser micromachining.